Sn plating and SnBi (plating for semiconductors)
Tin plating is a plating technology that imparts characteristics such as rust prevention, solderability, and electrical conductivity, and is used to improve the functionality of semiconductors and electronic components.
We use pure tin plating and tin-bismuth alloy plating to provide appropriate plated products based on the application and purpose of the product.
We also have various automatic plating equipment which enables mass production with stable quality,
such as rackless continuous plating equipment, barrel plating equipment, rack plating equipment, etc.
Delamination free process
Our delamination free process is a deburring process that enables the improvement of conventional alkaline immersion electrolytic deburring.
Our delamination free process has been highly evaluated and adopted by recent automotive customers.
Wet blasting
Water jet
Delamination free
Sn/SnBi rack typed plating line
Sn/SnBi, Sn rackless plating line
SnBi rackless plating line
※下記表は右にスライドすると詳細をご覧いただけます
| Thermosetting resin deburring line | Product | Number of machines | Spec. |
|---|---|---|---|
| Delamination free | Strips | 2 | L/F size 300×350㎜ |
| Deflash | Strips | 2 | L/F size 350×450㎜ |
| Deflash | Barel | 1 | L/F size 137×22㎜ |
| Alkaline dip | Strips | 2 | L/F size 350×450㎜ |
| High pressure WJ | Strips | 2 | L/F size 250×80㎜ Pres. 30MPa |
| Low pressure WJ | Strips | 3 | L/F size 250×80㎜ Pres. 15MPa |
| Wetbrasting | Strips | 3 | L/F size 250×78㎜ |
※下記表は右にスライドすると詳細をご覧いただけます
| Plating Line | Product | Number of mchines | Spec. |
|---|---|---|---|
| SnBi #OR1 | Strips | 1 | L/F 80㎜ Cu/42Alloy |
| Sn #OR2 | Strips | 1 | L/F 80㎜ Cu/42Alloy |
| Sn/SnBi #OR3 | Strips | 1 | L/F 100㎜ Cu |
| Sn | Barrel | 1 | L/F 137㎜ Cu/Al |
| Sn/SnBi rack #YS2 | Strips | 1 | L/F 300㎜ Cu/42Alloy |
| SnBi Barrel | Barrel | 1 | L/F 137㎜ Cu |